IOT-BASED ENVIRONMENTAL CONTROL IN 3D PRINTER ENCLOSURES FOR OPTIMAL PRINTING CONDITIONS
UDC: 004.771:[681.6:004.9-023.5]
DOI:
https://doi.org/10.46763/ETIMA2531112jSchlagwörter:
IoT, ESP32, 3D PrintingAbstract
With 3D printing becoming a widespread manufacturing process, maintaining optimal environmental conditions is crucial for achieving high-quality 3D prints. This paper explores an IoT-based environmental control system for 3D printer enclosures, designed to regulate temperature and humidity in real time. This system incorporates sensors, microcontrollers, cloud-based databases and mobile applications in order to maintain the desired 3D printing environment.
The automation of the control of the 3D printing conditions ensures higher-quality prints, improved material consistency and durability, and reduced print failures. Additionally, remote monitoring and mobile alerts provide users with up-to-date knowledge about the current and past environmental parameters, control of settings and additional control and command features.
Experimental results will demonstrate the effectiveness of the climate control system, which in turn highlights the potential for both professional and hobbyist 3D printing applications.
Downloads
Literaturhinweise
[1] S. Doloi et al., “Democratizing self-driving labs: advances in low-cost 3D printing for laboratory automation,” Digit. Discov., vol. 4, no. 7, pp. 1685–1721, 2025, doi: 10.1039/D4DD00411F.
[2] S. Saefudin et al., “A Review of Factors Affecting the Mechanical Performance of PLA in FDM 3D Printing,” Adv. Sustain. Sci. Eng. Technol., vol. 7, p. 0250208, Apr. 2025, doi: 10.26877/chs1gc62.
[3] W. Yu, M. Li, W. Lei, and Y. Chen, “FDM 3D Printing and Properties of PBAT/PLA Blends,” Polymers, vol. 16, no. 8, 2024, doi: 10.3390/polym16081140.
[4] C. Maraveas, I. V. Kyrtopoulos, and K. G. Arvanitis, “Evaluation of the Viability of 3D Printing in Recycling Polymers,” Polymers, vol. 16, no. 8, 2024, doi: 10.3390/polym16081104.
[5] K. Gunaydin and H. Türkmen, Common FDM 3D Printing Defects. 2018.
[6] I. Gibson, D. Rosen, and B. Stucker, Additive Manufacturing Technologies: 3D Printing, Rapid Prototyping, and Direct Digital Manufacturing. New York, NY: Springer, 2015. doi: 10.1007/978-1-4939-2113-3.
[7] I. Usembayeva, B. Kurbanbekov, S. Ramankulov, A. Batyrbekova, K. Kelesbayev, and A. Akhanova, “3D Modeling and Printing in Physics Education: The Importance of STEM Technology for Interpreting Physics Concepts,” Qubahan Acad. J., vol. 4, no. 3, pp. 45–58, Aug. 2024, doi: 10.48161/qaj.v4n3a727.
[8] M. Marciniak, “The 3D Printing in Military Applications: FDM Technology, Materials, and Implications,” Adv. Mil. Technol., vol. 18, no. 2, pp. 241–257, 28 2023, doi: 10.3849/aimt.01846.
[9] D. Ramadhan, F. Sodiq, H. Saputra, and M. Putra, “Dimensional Consistency Analysis in High Speed 3D Printing,” Turbo J. Program Studi Tek. Mesin, vol. 14, Jul. 2025, doi: 10.24127/trb.v14i1.3795.
[10]Y. Wei and H. Zhang, “Influence of Temperature and Humidity on Mechanical Properties of Calcined Oyster-Shell Powder-Modified 3D-Printed Concrete,” ACS Omega, vol. 9, no. 37, pp. 39180–39187, Sep. 2024, doi: 10.1021/acsomega.4c06129.
[11]A. Kafle, E. Luis, R. Silwal, H. M. Pan, P. L. Shrestha, and A. K. Bastola, “3D/4D Printing of Polymers: Fused Deposition Modelling (FDM), Selective Laser Sintering (SLS), and Stereolithography (SLA),” Polymers, vol. 13, no. 18, 2021, doi: 10.3390/polym13183101.
[12]F. Livolsli, T. May, D. Caputo, K. Fouladi, and B. Eslami, “Multiscale Study on Effect of Humidity on Shape Memory Polymers Used in 3D Printing,” J. Manuf. Sci. Eng., vol. 143, pp. 1–25, Mar. 2021, doi: 10.1115/1.4050550.
[13]D. Krapež, M. Jusufagić, M. Obućina, M. Kuzman, and M. Kariz, “Effect of Filament Material and Printing Temperature on 3D Printing Extrusion Force,” Appl. Sci., vol. 15, p. 2046, Feb. 2025, doi: 10.3390/app15042046.
[14]F. Al-Shalawi, A. Ariff, M. Ariffin, C. Kim, and D. Brabazon, “INFLUENCE OF NOZZLE TEMPERATURE, BED TEMPERATURE, AND PRINTING SPEED ON THE TENSILE STRENGTH OF 3D-PRINTED PLA SPECIMENS,” ASEAN Eng. J., vol. 15, pp. 85–90, May 2025, doi: 10.11113/aej.v15.22190.
[15]Y. L. A. Alshammari, F. He, and M. A. Khan, “Modelling and Investigation of Crack Growth for 3D-Printed Acrylonitrile Butadiene Styrene (ABS) with Various Printing Parameters and Ambient Temperatures,” Polymers, vol. 13, no. 21, 2021, doi: 10.3390/polym13213737.
[16]İ. Özsoykal, A. Yurt, and M. A. Selver, “Investigating the Temporal Stability of 3D-Printed PLA Samples under Ambient Storage Conditions: CT Attenuation Stability in 3D Printed Materials,” Adv. Med. Pyhsics Appl. Sci., vol. 1, no. 2, pp. 45–52, May 2025, doi: 10.63187/ampas.31.
[17]N. Ramos, C. Mittermeier, and J. Kiendl, “Experimental and numerical investigations on heat transfer in fused filament fabrication 3D-printed specimens,” Int. J. Adv. Manuf. Technol., vol. 118, no. 5, pp. 1367–1381, Jan. 2022, doi: 10.1007/s00170-021-07760-6.
[18]A. Saleh, A. Shbeeb, and M. Sattar, “Layer adhesion investigation of three dimension printed parts by controlling the environment temperature,” Adv. Sci. Technol. – Res. J., vol. 19, pp. 74–83, Jan. 2025, doi: 10.12913/22998624/197333.
[19]T. May, B. Eslami, and K. Fouladi, Optimization of 3d-Printer Enclosure Environment. 2021. doi: 10.21203/rs.3.rs-555977/v1.
[20]S. Thumsorn, W. Prasong, A. Ishigami, T. Kurose, Y. Kobayashi, and H. Ito, “Influence of Ambient Temperature and Crystalline Structure on Fracture Toughness and Production of Thermoplastic by Enclosure FDM 3D Printer,” J. Manuf. Mater. Process., vol. 7, no. 1, 2023, doi: 10.3390/jmmp7010044.
[21]R. Wibowo, A. Fauzi, and S. a, “ANALYSIS OF FAN COOLING SPEED, PRINTING SPEED AND LAYER HEIGHT ON PRODUCT GEOMETRY ACCURACY IN 3D PRINTING,” Int. J. Adv. Res., vol. 11, pp. 943–951, Sep. 2023, doi: 10.21474/IJAR01/17606.
[22]R. Grande, A. Vallejo-Peña, and C. Urzí Brancati, “The impact of IoT and 3D printing on job quality and work organisation: a snapshot from Spain,” Seville: European Commission, JRC125612, 2021.
[23]Y. Xie, W. Liu, Q. Yang, X. Sun, and Y. Zhang, “SharkNet Networks Applications in Smart Manufacturing Using IoT and Machine Learning,” Processes, vol. 13, no. 1, 2025, doi: 10.3390/pr13010282.
[24]“Bambu Lab Security,” Bambu Lab Wiki. Accessed: Jul. 14, 2025. [Online]. Available: https://wiki.bambulab.com/en/general/bbl-security
[25]B. Moezzipour and A. Moezzipour, “Thermal Behavior of Insulation Fiberboards Made from MDF and Paper WastesToplinska svojstva izolacijskih vlaknatica izrađenih od otpadnog MDF-a i papira,” Drv. Ind., vol. 72, pp. 245–254, Jul. 2021, doi: 10.5552/drvind.2021.2019.
[26]A. Zulfiqar, Hands-on ESP32 with Arduino IDE: Unleash the power of IoT with ESP32 and build exciting projects with this practical guide. 2024.
[27]A. Siswoyo, “Optimization of Temperature Sensor Selection for Incubators: Real-Time Accuracy Analysis of DHT22, LM35, and DS18B20 in Controlled Environment Simulations,” Internet Things Artif. Intell. J., vol. 5, Mar. 2025, doi: 10.31763/iota.v5i1.877.
